Space-Saving Device Offers Low Max. RthJC of 0.36 °C/W and Wettable Flanks to Improve Thermal Performance and Solderability ...

This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

May 21, 2025. More for You ...