More than ten years ago, researchers at Rice University led by materials scientist Boris Yakobson predicted that boron atoms ...

When exposed to periodic driving, which is the time-dependent manipulation of a system's parameters, quantum systems can ...

This paper purposes a method describing the crack propagation of chip on copper substrate solder joints. The chips that were studied are power transistors. They were soldered on copper substrate (NiAu ...

The flux used in conventional solder bump flip chip process is replaced by Cu nano ... in dealing with Cu nano-paste in terms of low resistance value and prestige copper surface.

HASL (hot air levelling): micro-cracks appear at the edge of the pad due to thermal stress, exposing the internal copper oxide layer. Failure of solder alloy and flux Solder impurities: aluminium (Al) ...

No Goop Solder Flux - Semi-solid solder wax consistency gives you superior control over application. Simply dip copper electric wires or apply electronic rosin flux to PCB and watch the solder flow!

International Center for Quantum Materials, School of Physics, Peking University, Beijing 100871, China Electron Microscopy Laboratory, School of Physics, Peking University, Beijing 100871, China ...