Gouri Sankar Kar, VP R&D compute and memory device technologies at imec, explains how the research organisation, in ...
Inference is projected to be a more than $250B market by 2030 [i]. Over the life of a model, the cost of inference is 15x more than training and utilization is growing at 31x per year [ii]. But many ...
Taara already uses beams of light to extend high-speed internet to places where traditional infrastructure is difficult to ...
Sarcina Technology, a specialist in semiconductor and photonic packaging, has won the “Packaging: Hardware” category at the 2026 Chiplet Summit Best of Show Awards for its advanced AI package design ...
Researchers at CEA-Leti and CEA-IRIG-SyMMES have validated a chip-scale electron paramagnetic resonance (EPR) spectrometer that achieves unprecedented scan speed, spectral span, and sensitivity from a ...
Marc Engel, chief executive officer of Agileo Automation, explains how the company has unveiled Agil’SECS-II - a new SECS-II ...
At IEEE ISSCC 2026, imec introduces a 7-bit, 175GS/s wireline ADC implemented in 5nm FinFET technology, combining a record-small footprint (250 x 250µm²) and low conversion energy (2.2 pJ per sample).
Yusuke Tsukahara , Corporate Strategy Officer, and Nobuo Takeda, Chief Operating Officer, and both C-Founders at Ball Wave, ...
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