Packaging-related solder fatigue has been identified as one of the main root causes of power electronic module failures. This paper presents a method to monitor solder fatigue inside a module by ...

High current density experiments on lead free solder joints coated with NiAu and non-coated Cu pads were conducted at -20°C, -30°C, -40°C and -50°C ambient temperatures. The time to failure (TTF) ...