Abstract: System-in-package (SiP) modules are widely used in portable electronics such as Internet of Things (IoT) devices and mobile consumer equipment since they integrate multiple components in a ...

The newly released CMT‑PLA1BL12300MA combines CISSOID’s advanced switching technology with the widely used CPAK‑EDC package, aiming to deliver a reliable and cost‑effective solution for systems ...

MALVERN, Pa., Jan. 21, 2026 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced four new 100 V Gen 2 Trench MOS Barrier Schottky (TMBS®) rectifier modules in the compact, ...

Vanilla OS and Bazzite are both immutable distributions. One is geared for general use and the other for gaming. Both are free to download and install. Immutability has become a buzzword in the Linux ...

MALVERN, Pa., Dec. 03, 2025 (GLOBE NEWSWIRE) -- Vishay Intertechnology, Inc. (NYSE: VSH) today introduced two new 1200 V MOSFET power modules designed to increase efficiency and reliability for medium ...

Raspberry Pi CM0 is a yet-to-be-officially-announced castellated Compute Module based on the Raspberry Pi RP3A0 SiP (System-in-Package) found in the Raspberry Pi Zero 2 W and Raspberry Pi Compute ...

6G is expected to bring data speeds that enable highly integrated and responsive technology in smartphones, homes, cities, and autonomous vehicles, but realizing that goal will require a lot more work ...

The company is also advancing its wafer-level optical co-packaged optics testing solutions, integrating offerings across wafer, package, and module levels. Combined with its high-end test sockets and ...

Featuring a compact high heat dissipation design, the new SiC molded modules set a new standard for OBCs. ROHM Semiconductor has introduced a new line of 4-in-1 and 6-in-1 silicon carbide (SiC) molded ...

The next decade is expected to see strong growth in the global usage of electric vehicles. As the charging infrastructure is developed and battery costs reduced, EVs are expected to dominate the ...