Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of ...

New TPU; TSMC revenue, export investigation; global semi equipment sales; 2D materials roadmap; acquisitions; UALink spec; EU ...

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

PCIe 6, released in January 2022, introduced a data transfer rate of 64 GT/s (gigatransfers per second), double that of its ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

At GTC 2025, Nvidia CEO Jensen Huang projected $1 trillion in global data center CapEx by 2028. At this pace, data center ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...

Researchers from Ulsan National Institute of Science and Technology (UNIST) and Pohang University of Science and Technology ...