Memory capacity also scales impressively. Across a pod, Ironwood offers 1.77PB of directly addressable HBM. That level sets a ...

Kioxia's UFS 4.1 memory devices are developed to meet the demands of next-generation mobile applications, including smartphones with on-device AI.

Lam Research Corporation is a $17 billion wafer-fabrication equipment maker. They are simulating and designing next generation computer memory. Its products are used primarily in front-end wafer ...

A new design for computer memory that could both greatly improve performance and reduce the energy demands of internet and communications technologies, which are predicted to consume nearly a third of ...

Computer memory could one day withstand the blazing temperatures in fusion reactors, jet engines, geothermal wells and sweltering planets using a new solid-state memory device developed by a team ...

Cambridge scientists have developed a new prototype for computer memory that could make for faster chips that could hold up to 100 times more data. The system is made up of barium bridges between ...