LONDON — Contract electronics manufacturing services company Barric Ltd. (Diss, England) has announced a plan to open a PCB rework and ball grid array repair laboratory. The lab is set to undertake ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

Compared to through-hole construction, inspecting SMD construction is a whole other game. Things you thought were small before are almost invisible now, and making sure solder got where it’s supposed ...