The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ...

Samsung Electro-Mechanics Co. and LG Innotek Co. on Wednesday showcased their latest package substrates for artificial ...

SINGAPORE — ST Assembly Test Services Ltd. this week announced availability of a thinner version of its small-thin plastic ball-grid array (STPBGA) package, which reduces the height to 1.2 mm compared ...

[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in develop… ...

Diagram of a ball grid array (BGA). Engineers can use digital image correlation (DIC) to assess its thermal expansion or warpage due to thermal, mechanical and thermo-mechanical loads. DIC is an ...