3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, ...

The multiple demands of 3D NAND to enable yield and performance increase in difficulty at each generation. First generation devices, at 24-32 layer pairs, pushed process tools to extremes, going ...

The part 1 of this two-article series outlined the NAND flash technology and how it transitioned from 2D to 3D NAND flash. The article also explained the current challenges in the way of density ...

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...

Micron and SK Hynix are turning up the pressure on each other with 3D NAND chips made up of more than 230 layers. Check out more coverage of the 2022 Flash Memory Summit. Memory chip giants are upping ...

Yangtze Memory Technologies Co. (YMTC) has quietly started to ship its 5th-Gen 3D NAND memory with 294 layers in total as well as 232 active layers, and analysts from TechInsights have managed to ...

South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues to ...

SanDisk on Wednesday introduced an interesting new memory that could wed the capacity of 3D NAND and the extreme bandwidth enabled by high bandwidth memory (HBM). SanDisk's high-bandwidth flash (HBF) ...

In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its high-density storage ...

Dell on Monday unveiled what it called the first all-flash storage array to feature TLC 3D NAND technology, which the company said brings the cost of all-flash storage solutions to as low as $1.66 per ...