TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

The new A20 Pro chip is expected to debut in Apple’s iPhone Fold and iPhone 18 Pro, delivering major performance and ...

Apple's foldable iPhone will share the same next-generation A20 Pro chip as the iPhone 18 Pro and iPhone 18 Pro Max models ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

According to a new report from Taiwan, the upcoming A20 chip will cost Apple a massive $280 per unit. This apparently ...

Industry experts are closely tracking the development of the Apple 2nm A20 Pro chipset, expected to launch in late 2026.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...

Apple is expected to debut its next-generation 2nm A20 chipset in the iPhone 18 Pro lineup, promising faster performance, improved efficiency, and better thermals thanks to cutting-edge chip packaging ...

TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration called ...

Apple’s upcoming A20 chip is rumored to be exclusive to the iPhone 18 Pro, Pro Max, and the company’s first foldable phone, marking a major performance leap with TSMC’s 2nm process. Base iPhone 18 ...

Apple is anticipated to unveil its first foldable device, the iPhone Fold, alongside the iPhone 18 Pro and Pro Max this ...