The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

The More than Moore era is upon us, as manufacturers increasingly turn to back-end advances to meet the next-generation device performance gains of today and tomorrow. In the advanced packaging space, ...

Digital lithography technology (DLT) is promising chipmakers to combine chips with submicron wiring on glass and other large substrates. And this maskless technology is at the center of a strategic ...

Heterogeneous integration technology refers to the integration of separately manufactured components into a higher-level assembly, or system in package (SiP), that in the aggregate, provides enhanced ...

Are you feeling nostalgic for homogeneous integration of chips – one flat board where you can use your fingers to stuff in all the circuitry you need? Best to head to the Lego store or Russia. The ...