This new technical paper titled “End-to-end deep learning framework for printed circuit board manufacturing defect classification” is from researchers at École de technologie supérieure (ÉTS) in ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
The evolution of PCBs from large and antiquated “printed wiring boards” to today’s fine-line designs on high-density interconnect (HDI) PCBs, IC substrates (ICS) and more, has been matched by ...
Conversely,experienced embedded designers know to mask or tent BGA vias at thedesign and layout level. Even when this step is omitted, adesign-for-manufacture (DFM) check mapped out at the planning ...
What methods can be applied to verify PCB functionality and safety? Which are suitable for mass production and for prototypes? What parameters are checked in each test? How to check a PCB without ...
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