Sometime in 2027 to 2028, AMD could release Medusa Halo, its next-gen entry in the high-performance Halo APU lineup. It's ...

Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now ...

AMD's next-generation 'Halo' APU seems likely to use bleeding-edge LPDDR6 memory for nearly double the bandwidth.

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

Despite strong gains this year, Samsung Electronics and SK Hynix shares are even less expensive than their U.S. counterparts.

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...

We all know Nvidia is enjoying life as the belle of the AI ball, thanks to its hardware being the gold standard for training AI models. Now, it appears it'll be bringing its hardware partners along ...

Micron Technology (NasdaqGS:MU) has started building a US$24b advanced wafer fabrication plant in Singapore. The facility is ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...

High bandwidth memory (HBM) has always lived up to its name, it just has not been as widely adopted in mainstream graphics cards as GDDR memory chips. Maybe that will change when HBM3 arrives.

March 8, 2022 Timothy Prickett Morgan Compute Comments Off on A Cornucopia Of Memory And Bandwidth In The Agilex-M FPGA When it comes to memory for compute engines, FPGAs – or rather what we have ...

AI doesn't just need memory; it also needs massive storage capacity. Western Digital is a leader in developing advanced 3D ...