IC packaging has come into its own, where once traditional packaging was a “necessary evil,” today’s packaging can add significant value. There is an increase in functional density and flexibility by ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services “We are pleased to collaborate with Cadence, a leader in electronic design software, ...

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

AI compute is scaling at ~1.35× per year, nearly twice the pace of transistor scaling. Thus, the semiconductor industry has reached a hard inflection point: if we can’t scale down, we must scale up.

Imec has announced that its ASIC and silicon photonics services division, IC‑Link, has joined TSMC’s 3DFabric Alliance.

Expands global ASIC services expertise and aims to take on the industry’s most advanced AI, HPC, mobile and automotive projects LEUVEN (Belgium) — Imec, a world-leading research and innovation hub in ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond Tool, ...

The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...