JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls.
Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...
AMD’s Fuji was one of the first GPUs to use JEDEC’s High Bandwidth Memory (HBM) DRAM standard and now JEDEC has released an update which should attract others. JEDEC has announced an update to ...
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