Decapsulation of plastic IC packages in different types and size were performed by wet chemical technique. Studied devices were to use in satellites and going to subject a series of test which require ...

Two expectations informed end-users have of electric motor service centers are reliable best practice repairs and root cause failure analysis (RCFA) to prevent recurring failures. Service centers ...

Once confined to analyzing returns, it now is shifting left and right as more data analytics are applied to both digital and analog. Failure analysis is rapidly becoming a complex, costly and ...

These developments continue to fuel growing investment into the technology and manufacture of semiconductor devices at both industrial and academic research levels. Improvements in technology, ...

The first step for semiconductor chips is visual inspection using an optical microscope or electrical measurements. 2 Mechanical probing, electron beams, emission microscopy, liquid crystal, etc., are ...

In this interview, AZoM talks to Dr James Woods, Senior Research Scientist at Jordi Labs, about product failure analysis, and how to determine its root cause. Product failure can occur whenever the ...

Each phase of a project has unique failure signature patterns. Just like the bathtub curve in Figure 2, we see more “failures” in the initial design, development and early production “ramp up” phase.