The rise of artificial intelligence (AI) and the new energy / autonomous vehicle industry presents both challenges and exciting opportunities for the printed circuit board (PCB) and packaging ...
SAP enables AT&S to manufacture printed circuit boards and IC substrates of a size and complexity that almost rivals products from the semi-conductor industry. mSAP stands for “modified semi-additive ...
Taiwan's leading IC substrate maker Unimicron Technology will invest NT$30 billion (US$981.03 million) to set up a new plant in Taiwan dedicated to production of IC substrates with high layer count ...
Conventional PCB manufacturing—which is wasteful, energy intensive, and harmful to the environment—increasingly calls for electronics recycling to reduce material waste and energy requirements through ...
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