MUNICH, Germany — IBM and Austriamicrosystems have agreed to share a jointly developed high voltage CMOS manufacturing process. This will enable both companies as well as their foundry customers to ...
With picosecond ultrasonic technology, manufacturers have a powerful, non-destructive tool for monitoring thickness and ...
Conexant Systems Inc. today announced it will discontinue its digital CMOS manufacturing operations and will become a fabless company. The Newport Beach, Calif.-based company also said it plans to cut ...
The Crolles2 Alliance has described at the VLSI Symposium in Kyoto, Japan, the creation, under production conditions, of six-transistor SRAM-bit cells with an area less than 0.25 square microns—half ...
Philips ramped up three key 90-nm CMOS products into volume production at the Crolles2 Alliance wafer fab in Crolles, France. The products are baseband chips for highly integrated system-inapackage ...
A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...
Imec, perhaps the world's top semiconductor research center, has created the first monolithic III-V CMOS transistors on 300mm silicon wafers. With current silicon-based transistors hitting a wall at ...
Micledi Microdisplays, a Leuven, Belgium-based developer of microLED displays for high-end augmented reality (AR) glasses, has demonstrated the industry's first microLED arrays-for-AR built on a 300mm ...
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