Nvidia can design a brilliant AI chip. TSMC can etch its transistors at atomic scale. But if there is no room on the advanced ...

The news is coming from Taiwanese media outlet Ctee, reporting that the Chiayi Science Park was finalized this year and is expected to build two advanced packaging plants first. The first phase of ...

TSMC has spent years guarding its most advanced chip packaging technology, building out capacity internally and keeping the ...

APS Files Two U.S. Provisional Utility Patent Applications Supporting Its Agentic AI Platform for Adobe Illustrator and ...

AI memory shortage enters a new phase as AMD CEO Lisa Su identifies high-bandwidth memory — not advanced packaging — as the ...

Nvidia is riding high now that the tech industry has suddenly pivoted to making everything about AI. It's a fortunate turn of events for the GPU maker, as its data center GPUs are largely considered ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

The news about Samsung snapping an advanced packaging order for Nvidia’s AI chips paired with high-bandwidth memory (HBM) chips underscores the strategic importance of next-generation packaging ...

The big picture: The pairing of TSMC's Arizona fab and Amkor's planned packaging plant nearby represents a gradual shift toward regionalized semiconductor production – one that may, over time, reduce ...

With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing and packaging ...

As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers to adopt a more ...