South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

SK Hynix ( HXSC.F) plans to invest 19 trillion Korean won ($12.9 billion) to build a new advanced packaging plant in the ...

Great news for AMD and Nvidia, less so for cash-strapped consumers Memory makers just can't churn out their DRAM fast enough.

When classic 2D scaling dominated, the industry’s center of gravity was disinflationary: Chip average selling prices (ASPs) ...

TSMC will hold its earnings call on January 15, 2026. Supply chain sources expect AI chip demand to remain strong in 2026, ...

SK Hynix will invest 19 trillion won in a new advanced chip packaging facility in Cheongju to boost capacity for AI-driven ...

SK Hynix will invest 19 trillion Korean won to build an advanced packaging fab in Cheongju, North Chungcheong Province. On ...

In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...

Just as the new plant located in Nanke Chiayi Park in Taiwan is expanding production, the downstream supply chain broke news that TSMC is eyeing off going to Pingtung to build a new CoWoS advanced ...

GF will make an initial investment of $575M, create 100 jobs at the New York Advanced Packaging and Photonics Center in Malta. G lobalFoundries (GF) plans to create a new center for advanced packaging ...

TL;DR: TSMC plans to increase prices for its 5nm and 3nm process nodes by 5-10% and CoWoS advanced packaging by 15-20% due to high AI demand. These price hikes are expected in January 2025. The 3nm ...